It comes alive with state-of-the-art production.
At Buildex Electronics, our equipment offers a higher level
of versatility, efficiency and accuracy. The Philips CSM84VZ surface mount
placement system can cope with specialized high-mix production as well
as the newest generations of fine pitch IC packages thanks to enhanced
accuracy. It is also fast and economical. As a result, you receive amazing
quality with consistently quick turnaround times.
The Philips CSM84VZ's capabilities include:
production of up to a 12 mil pitch device and small-size
assembly on a multiple array board
component part to circuit board pad matching and placement
integrated, computer-controlled vision system with
detection of bad board geometric readings and array
precise placement of unique components such as PLCCs,
LCCs and MELFs
For your thru-hole technology needs, we offer the
Electrovert Wave Solder. Used together, these technologies can create virtually
any mixed board configuration you can dream of.
Despite this technology and range of capabilities, our
overhead is lower than competitors and so is the price we charge you. From
PC board and wire and cable assemblies to electromechanical assembly and
completed products, we are your single source for turn-key savings and
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